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Best Thermally Conductive Insulators

Jun 25

The Power of Thermally Conductive Insulators management in electronic devices is a key aspect to their performance and functionality. This involves keeping the internal temperature of an electronic component as low as possible and protecting it from excessive heat that can damage it or cause it to overheat. The best way to accomplish this is by using materials that have good electrical conductivity but limit the transfer of heat. This is the goal of thermally conductive insulation.

The most common type of thermally conductive insulation is made from fiberglass and is available in different forms such as blankets (batts or rolls), loose-fill, or rigid boards. These products come in different R-values that indicate how effective they are at insulating. R-values are determined by the thickness of the material and how much air is trapped between it. A material with a higher R-value has a greater insulating capability.

Other types of thermally conductive insulation include polyurethane foam insulation and expanded polystyrene (EPS). These products are generally a little more expensive than traditional fiberglass batt insulation, but they offer higher R-values. Polyurethane foam insulation can be produced in closed-cell or open-cell formulations. Closed-cell foam is more dense and contains a gas that helps it expand to fill spaces. Open-cell foam is less dense and contains a gas that allows it to retain its shape.

Another type of thermally conductive insulation is graphene. This is an extremely thin, carbon-based material with excellent mechanical properties and a high electrical conductivity. It is considered a potential replacement for many traditional insulators and has been tested as an alternative to lead-free solder. However, producing it on a large scale is still challenging, and more research is needed to determine whether or not it can be economically viable.

Advanced 3D integrated circuit technologies require high-performance insulators. These are usually required to meet the needs of high-speed communication and signal transmission, as well as the ability to keep power consumption low. They also have to be able to provide thermal protection while allowing for easy cooling.

While the physical structure of the 3D-IC system is more compact than a monolithic chip, it is not immune to the same thermal challenges as traditional circuits. This is because there is a mismatch between the time constants of electrical activity and the thermal conduction process. This means that profiling of 3D-IC systems requires longer times than for conventional monolithic chips to capture the varying thermal inputs.

CMI has developed a line of thermally conductive electrical insulators that are designed to meet these challenging demands. The CHO-THERM series features a thermally conductive phase change compound coated on a Polyimide film. It is also available in a variety of sizes to suit a wide range of applications requiring high thermal, dielectric, and cut-through resistance. For more information about our thermally conductive electrical insulators, please contact us today. We look forward to hearing from you.


Custom Materials, Inc
16865 Park Circle Drive
Chagrin Falls, Ohio 44023
(440) 543-8284