Flexible Thermal Gap Pads For Power Semiconductor Applications
Unlike thermal grease, which is fine-tuned to an assembly and is formulated to maintain its initial performance over the long term, gap filler pads (also known as thermal blankets or thermal interface materials) are designed to be flexible enough to deform various gaps. They are able to provide consistent thermal transfers between components of varying tolerances and flatnesses.
It is important to know What is Thermal Gap Pad ,Use a thermal pad between a semiconductor power or any other electronic components and a heat sink in order to ensure a good connection while maintaining a low interface temperature. The gap filler should be able not only to resist vibration damage, but also to withstand the high clamping force that is usually associated with these applications.
The data sheet will provide a range of physical attributes such as hardness, thermal conductivity and thickness. These values, however, are only indicative in the case where a thermal pad is used, as they could vary significantly when dynamic compression occurs. A datasheet may state, for instance, that the material will deflect with 1,000 newtons at 5 millimeters per second. When the same material is stressed with a displacement equivalent to 100 millimeters a minute at 16,000 tons of force, however, it will exceed its capabilities.
To solve this problem, manufacturers have created a wide range products that are flexible. They offer a variety in thermal conductivities of 3 to 12 W/m.K. UL 94-V0 is also rated on most products. They can be supplied in 300mm x200mm sheet sizes for easy handling.
These materials have high dielectric strengths and are generally resistant to rust. They can therefore be used for a variety electrical applications. Saint-Gobain makes a line of thermal gap pads called Thermacool Gapfillers. They include the TC3006 - highly compliant (1.1 W/m-K), TC2006 - compromise compliant (1.6 W/m-K), TC-3008 - high performance (3.1 W/m-K).
Henkel has a GP family of pads. The GP pad series is a flexible and high-performance material designed to be applied easily and conform to the mating surfaces. These materials are low in modulus, meaning they can be compressed easily to minimize stress and strain at the interface while maintaining excellent reliability testing results.
In addition, henkel's GP pads are naturally tacky on both sides, allowing them to be placed between the mating surfaces without the need for additional adhesives that could potentially inhibit thermal performance. The GP pads can be pressed in place quickly and easily, without requiring manual handling.
Stockwell Elastomerics offers all of these products and our application engineers are experienced in helping customers select the best gap filler to suit their needs. Contact us today for more information on selecting the right material for your project. We are happy answer any questions that you may have, and to discuss the thermal management needs of your specific application.